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ACF帮定

在柔性和刚性电路板、玻璃显示器和焊距非常细密(<30微米)的柔性箔片之间建立导电帮定的过程即被称为 ACF帮定。  这个过程的基本特征是在压力下对粘合剂进行加热和冷却。

Small, spherical particles are suspended in the adhesive, which can be in the form of foil, flex or paste. Before bonding, the particles are separated by an isolating matrix of adhesive. The parts to be joined are first brought together with the adhesive in between, and tacked (ACF自动层压). Temperature, time and pressure are applied and cause plastic deformation of the adhesive and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis.

粘合剂随后将在压缩状态下加以冷却并充分固化,最终使接合面稳定下来。


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