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Amada Miyachi offers a comprehensive line of standard and custom equipment and systems to address your welding, bonding, sealing, marking and cutting needs. We believe in partnering with our customers from conceptual design to production; innovative process solutions form the foundation of every product we build.

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热压焊和帮定系统

ACF层压/预粘结系统

ACF层压/预粘合系统图片

ACF层压/预粘结系统

  • 紧凑灵活的系统设计
  • 恒热控制器
  • 工件可左右前后移动或旋转
  • 可选件包括升级型Uniflow脉冲加热电源、遮光保护板和带式内插器模块
  • 产品详情

    ACF(各向异性导电薄膜)层压机设计用于细间距ACF粘合应用(>30微米),使用两步或三步过程将诸如柔性锡箔等材料连接到玻璃或PCB上。

    ACF Laminating/Pre-Bonding is achieved by dispensing and cutting the ACF tape, positioning over the surface of the parts to be bonded, and moving the thermode into position.  The flex is then moved into position to align the traces to the substrate, and the thermode is actuated to complete the bond.

    The basic systems includes a constant heat power supply and pneumatic bonding head.  Options include replacing the constant heat power supply with a Uniflow脉冲加热回流焊接和粘合电源,还有带式内插器、对准工具或工件夹具模块。

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ACF(各向异性导电薄膜)层压机设计用于细间距ACF粘合应用(>30微米),使用两步或三步过程将诸如柔性锡箔等材料连接到玻璃或PCB上。

ACF Laminating/Pre-Bonding is achieved by dispensing and cutting the ACF tape, positioning over the surface of the parts to be bonded, and moving the thermode into position.  The flex is then moved into position to align the traces to the substrate, and the thermode is actuated to complete the bond.

The basic systems includes a constant heat power supply and pneumatic bonding head.  Options include replacing the constant heat power supply with a Uniflow脉冲加热回流焊接和粘合电源,还有带式内插器、对准工具或工件夹具模块。

ACF层压/预粘合系统规格表

    用于桌面热压焊接系统的热电极

    适用于DT系列桌面型帮定系统热压焊接头模块的热电极

    热电极力度校准

    热电极力度校准套件

    压敏纸

    测量热电极平面度的压敏纸

    胶带

    用于内插器模块的胶带

    硅胶带

    用于内插器模块的硅胶带

    温度计

    热压加工过程中手持式测温计