Laser stripping machines are a fast and efficient method for removing partial or full sections of materials and tapering edges. The laser is well suited for material removal as required for the stripping of outer layers of polymers from small diameter wires for many medical device applications. The laser offers a process that is non contact, very repeatable, can selectively remove layers, can selectively remove areas and is easily automated. The laser transforms a key step in the manufacturing process to a lean operation, reducing and optimizing human-dependent processes and providing consistent part quality
For each material, wire diameter and feature requirement there is a suitable laser that will match the criteria. From the sealed CO2 laser to UV nanosecond lasers and even to femtosecond lasers all offer different processing capability. Our in-house applications labs have all of these different types of lasers enabling our engineers to select the best laser for the application. As with all Amada Miyachi systems projects, everything starts with the application which serves as the foundation to the system configuration.