创新产品

Amada Miyachi offers a comprehensive line of standard and custom equipment and systems to address your welding, bonding, sealing, marking and cutting needs. We believe in partnering with our customers from conceptual design to production; innovative process solutions form the foundation of every product we build.

产品


系统

激光切割和微细加工系统

剥线机

剥线机的图片

剥线机

剥线机运用激光去除涂层和绝缘材料

  • 去除含氟聚合物、聚酰亚胺、尼龙、PET和硅涂层
  • 可选激光源包括CO2、UV和皮秒/飞秒激光
  • 末端和中段去除
  • 可选自动部件控制
  • 定制机器配置
  • 产品详情

    The stripping of wire insulation or coatings in order to provide electrical contact points for cardiac rhythm management, neuromodulation devices, or other downstream manufacturing processes is a common requirement in the medical device manufacturing industry.  Moving from manual intensive processes to an automatic wire stripping machine offers great gains in productivity and quality.  

    Laser stripping machines are a fast and efficient method for removing partial or full sections of materials and tapering edges.  The laser is well suited for material removal as required for the stripping of outer layers of polymers from small diameter wires for many medical device applications.  The laser offers a process that is non contact, very repeatable, can selectively remove layers, can selectively remove areas and is easily automated.  The laser transforms a key step in the manufacturing process to a lean operation, reducing and optimizing human-dependent processes and providing consistent part quality

    For each material, wire diameter and feature requirement there is a suitable laser that will match the criteria.  From the sealed CO2 laser to UV nanosecond lasers and even to femtosecond lasers all offer different processing capability.  Our in-house applications labs have all of these different types of lasers enabling our engineers to select the best laser for the application.  As with all Amada Miyachi systems projects, everything starts with the application which serves as the foundation to the system configuration.

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The stripping of wire insulation or coatings in order to provide electrical contact points for cardiac rhythm management, neuromodulation devices, or other downstream manufacturing processes is a common requirement in the medical device manufacturing industry.  Moving from manual intensive processes to an automatic wire stripping machine offers great gains in productivity and quality.  

Laser stripping machines are a fast and efficient method for removing partial or full sections of materials and tapering edges.  The laser is well suited for material removal as required for the stripping of outer layers of polymers from small diameter wires for many medical device applications.  The laser offers a process that is non contact, very repeatable, can selectively remove layers, can selectively remove areas and is easily automated.  The laser transforms a key step in the manufacturing process to a lean operation, reducing and optimizing human-dependent processes and providing consistent part quality

For each material, wire diameter and feature requirement there is a suitable laser that will match the criteria.  From the sealed CO2 laser to UV nanosecond lasers and even to femtosecond lasers all offer different processing capability.  Our in-house applications labs have all of these different types of lasers enabling our engineers to select the best laser for the application.  As with all Amada Miyachi systems projects, everything starts with the application which serves as the foundation to the system configuration.
  • 微型同轴电缆剥线的照片

    微型同轴电缆剥线

  • 同轴电缆剥线的照片

    同轴电缆剥线

  • 经激光剥线处理的电线图片

    经激光剥线处理的电线